Date & Time

April 22, 2026 09:30 PM IST

Venue

Santa Clara, April 22, 2026
Austin, May 5, 2026
Boston, May 14, 2026
Amsterdam, May 28, 2026

ACL Digital at TSMC 2026 Technology Symposium

Advancing AI Chips on Leading-Edge Silicon Technologies

ACL Digital will exhibit at the TSMC Technology Symposium 2026 at Booth No. 916. Connect with our silicon engineering experts to explore our AI-driven semiconductor solutions and learn how we advance next-generation AI chip development.

At our booth, explore AI accelerators built on advanced nodes (N6 to N2 and beyond), HBM-integrated architectures, PCIe/UCIe subsystems, and 3DFabric-based chiplet integration—enabling scalable and high-performance AI chips. We also showcase expertise in efficient design flows for emerging technologies such as N2, A16, and beyond.

At ACL Digital, we go beyond engineering to drive innovation across AI/ML, HPC, SERDES IP, and IP porting, with a strong focus on enabling advanced AI chips across multiple domains.

Centers of Excellence & Trusted Collaborations

Centers of Excellence

AI Chip
Automotive Chip
IoT Chip
Networking Chip
Analog & Mixed Signal
Semiconductor Embedded Software
Chiplet Engineering

Trusted Collaborations

TSMC Design Center Alliance
Arm Approved Design Partner

Core Strengths

RTL to GDSII
PCIe/UCIe/DDR/Ethernet subsystems
Analog mixed signal
SERDES IP
AI SoC & HBM integration (enabling advanced AI chips)
Advanced nodes (N6–N2) with FuSa
Physical implementation for leading-edge TSMC nodes

TSMC 2026 Technology Symposium Highlights

TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes, and beyond
TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more
TSMC’s manufacturing excellence, capacity expansion plans, and green manufacturing achievements
TSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design