ACL Digital at the TSMC 2022 OIP Ecosystem Forum

Date & Time
October-26 09:00 am to October-26 18:30 pm
Santa Clara, CA, United States

ACL Digital, an ALTEN group company, was part of the TSMC 2022 Open Innovation Platform Ecosystem Forum. As a global leader in engineering and technology consulting, the company has a rich repository of Centre of Excellences (CoEs) in High-Performance Computing (HPC), Automotive Semiconductor, Wireless Networking & IoT market segments. In the forum, we exhibited our capabilities in multiple categories, including:

  • TSMC Design Centre Alliance
  • RISC-V Centre of Excellence
  • ARM Approved Design Centre
  • Functional Safety and ISO 26262 Centre of Excellence

Our core strengths:

  • CPU Subsystems
  • Memory Subsystems
  • Interface Subsystems
    • High Speed Interface Subsystems
    • Low Speed Interface Subsystems

The TSMC 2022 Open Innovation Platform Ecosystem Forum was held on Wednesday, October 26, at the Santa Clara Convention Center in Santa Clara, California. The event highlighted the following:

  • Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies
  • Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications
  • Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration, mmWave RF, and automotive designs targeting automotive and IoT designs
  • Ecosystem-specific TSMC reference flow implementations, P&R optimization, machine learning to improve design quality and productivity, and cloud-based design solutions
  • Successful, real-life applications of design technologies and IP solutions from ecosystem members
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