TSMC North America 2025 Open Innovation Platform Ecosystem Forum

The 2025 TSMC Open Innovation Platform Ecosystem Forum, which will be held at the Santa Clara Convention Center, brings together innovators and industry leaders to visualize the future of semiconductor design engineering and innovation. Drop by the ACL Digital Booth 815 at this TSMC event and learn about the latest advancements in AI chips, with a special focus on AI accelerators built on TSMC N6-to-N2 nodes, HBM-integrated designs and PCIe/UCIe subsystem architectures, as well as custom analog IP products and disruptive technologies.

As a TSMC Open Innovative Platform® (OIP) DCA partner, ACL Digital is excited to showcase the latest advancements in SoC, ASIC, and embedded software, including end-to-end AI chip design, HBM and UCIe-enabled accelerator integrations, and node migration expertise from N6 down to N2, and how we drive AI and silicon technology innovation.

At ACL Digital, we go beyond engineering to empower the next wave of digital transformation at the intersection of AI/ML, HPC, SERDES IP design, and IP porting. We specialize in AI accelerators and subsystem integration (PCIe, UCIe, HBM), and design for Functional Safety (FuSa/ISO 26262) across advanced nodes. Through our specialized Centers of Excellence, we support businesses to drive progress in automotive semiconductors, IoT, 5G, wireless networking, and semiconductor global capability centers.